Anaren Launches Xinger-III Brand Hybrid and Directional Couplers

SYRACUSE, N.Y., July 28, 2010 (GLOBE NEWSWIRE) -- Anaren, Inc. (Nasdaq:ANEN) announced today that it has officially launched its Xinger®-III brand line of 3dB hybrid and directional couplers for wireless infrastructure applications. At ¼ the size of the company's previous generation parts (Xinger-II components remain popular and in production), the design and unique manufacturing processes behind the new Xinger-III offer the same power handling, among other advantages.

"As competitors try to catch up with our last gen part, we've already reinvented and surpassed it for new gains in performance and what is, frankly, a startling footprint improvement," say General Manager for Anaren's Wireless Group, Hans Peter Ostergaard. "We're offering this part as an option to our customers who want such advances now to keep pace with their nextgeneration base station equipment designs -- not as a part they must migrate to from our still successful previous Xinger models."

Emphasizing that the new components feature patent-pending design and materials advances, Ostergaard says that the new Xinger-III line's tiny footprint and robust power-handling capability make it a viable alternative to ceramic equivalents without the risk of cracked solder joints that ceramics can create when their thermal expansion characteristics don't match the PCB they are mounted to." Because Anaren's new parts are softboard, the co-efficient of thermal expansion (CTE) disparity doesn't exist – liberating designers to specify ordinary PCBs without having to worry about CTE mismatch.

"The small 0.25 x 0.2 and 0.56 x 0.2 footprints for this line are also standardized from previous Xinger-brand component generations," adds Ostergaard, "which is increasingly a requisite for OEMs in the wireless infrastructure space, who are trying to standardize the equipment they deploy around the world as a cost-control measure."

When compared to equivalent-sized parts from the previous-generation Xinger-II brand part family, the new Xinger-III brand hybrid coupler line offers:

  • 52-66% lower insertion loss (down to 0.12dB)
  • 5.35 times the power handling
  • 25-28% higher isolation
  • 63-71% better amplitude balance
  • Equal phase balance

While, at ¼ the size, the new Xinger-III brand directional family delivers:

  • 37-64% lower insertion loss (down to 0.05dB)
  • 50% higher power handling
  • Equal directivity

The product family currently includes the following components, with several additional parts to be made available shortly after the launch. The components may also be sourced through Anaren's authorized stocking distributors.


 An innovative leader in microwave and RF technology, Anaren designs and manufactures complex components and subsystems for defense, satellite, wireless, and consumer electronics markets.

Category: Press Releases

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