Loading...
25Jan

Anaren Introduces New 1.5-1.7GHz Ultra-Low Profile 3dB, 90 Degrees Hybrid Coupler

Measuring Only 0.08 x 0.05 Inches (2 x 1.29 mm), New Ultra-Low-Profile 3dB, 90º Hybrid Coupler Offers Class-Leading Insertion Loss and is Particularly Well-Suited for GPS and SAT Radio Applications.

25Jan

Anaren Introduces Submini Central Online Resource for Users of Its Xinger-Brand Subminiature Passive RF Components

New Online Resource Features Introduction to New Components in the Anaren Line-Up, Including "0805" Format 10dB and 20dB Directional Couplers.

11Dec

Anaren, Inc. Introduces New AIR Module Family for ZigBee(R) Standard and New BoosterPack Kit

Kit to Help Engineers Develop ZigBee Wireless Applications Using Texas Instruments MSP430(TM) and Stellaris(R) LaunchPad Development Kits.

05Nov

AIR Modules to be Sold Through Premier Farnell

Family of tiny, ETSI-compliant and IC/FCC-certified RF transceivers — based on Texas Instruments' low-power RF chips — are the first-ever Anaren product lines to be added to Premier Farnell line card and supported through the element14 Community.

11Jul

AIR Modules For ZigBee® Standard Applications Achieve Certification Standards

Modules to be FCC- and IC-certified, as well as compliant with Europe's ETSI standard.

01Jan

Anaren Integrated Radio (AIR) Modules to be Sold Through RS Components

Anaren's Family of Tiny, ETSI-Compliant and IC/FCC-Certified RF Transceivers -- Based on Texas Instruments' Low-Power RF Chips -- is the First Anaren Product Line to be Added to the RS Line Card and Supported Through the Company's DesignSpark Online Community.

01Dec

Anaren Develops sub-1 GHz Wireless Connectivity Module and BoosterPack for Texas Instruments

Module for MSP430(TM) MCU Value Line LaunchPad Development Kit. AIR-Equipped Kit to be Part of TI's Portfolio of BoosterPacks Available Through Its Supply Chain; Anaren Will Also Offer BoosterPacks Featuring Its Other AIR Modules.

07Jun

Anaren Launches Line of Xinger-Brand, Subminiature Directional Couplers for Wireless Infrastructure and Consumer Electronics Applications

New Line of "0805" Components Saves Valuable Board Space and Offers Performance Advantages Compared to LTCC Parts.

22Apr

Anaren Launches New Line of Xinger(R)-III Brand, Surface-Mount Doherty Combiners for Wireless Amplifiers

New Line of Components Save Valuable Board Space and Offer Performance Advantages Over Traditional Doherty Combiners Printed on PCB.


Have questions?

Contact Us