Capabilities

  • 004 mil Laser defined vias
  • .006 mil Drilled hole diameter
  • .002 mil Line & Space
  • .006 mil COB (chip on Board)
  • .4mm pitch BGA packages
  • Conductive (CB100 & Ormet) via fill
  • Non Conductive (PHP-900, Peters 2795, and Taiyo THP 100) via fill
  • Horizontal / Vertical Multi-Level Launch Sites
  • Precision Back drilling
  • Multi Sequential Lamination
  • Fusion Bonding
  • Core to Core Bonding
  • Heatsink Bonding
  • Teflon Metal back
  • CIC / Copper core
  • Heavy Copper / Thermal vias
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